High Strength Hollow Glass Microspheres with Lower Thermal Conductivity

Product Details
Customization: Available
Fiberglass Type: Hollow Glass Microspheres
Certification: CE
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  • High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
  • High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
  • High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
  • High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
  • High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
  • High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
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  • Overview
  • Product Description
  • Product Feature
  • Application
  • Packaging & Shipping
  • Company Profile
Overview

Basic Info.

Model NO.
BH-HGM
Technique
Powder
Usage
Chemical Engineering, Chemical Industry Product, Sewage Treatment, Construction
Source
Fiber
Material
Hollow Glass Microspheres
Structure Feature
Ultra-Light Inorganic Non-Metallic Powder with Ho
Type
Bag Packing1
Effect
Higher Filler Loading, Lower Viscosity/Improved FL
Advantage 1
Light Weight
Advantage 2
Bulk Density
Advantage 3
Lower Thermal Conductivity
Advantage 4
Higher Compressive Strength
Advantage 5
Mproved Dispersion and Liquidity
Application
Filler Materials
Transport Package
Carton/Pallet
Specification
H20/H40/H46/H60
Trademark
CHINA BEIHAI
Origin
Anhui
Production Capacity
10000t/Year

Product Description

Product Description

Thermal Insulation Lightweight Cenosphere Hollow Glass Microsphere

High-performance hollow glass microspheres, the true density 0.25 ~ 0.60g/cm3,

the particle size between 2 ~ 125μm, the compressive strength at 5 ~ 82MPa (725 ~ 12000PSI), 

the thermal conductivity of 0.05340-0.100040W / m . k. Products are light weight, bulky, low thermal conductivity,

high compressive strength and good liquidity characteristics.

High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
High Strength Hollow Glass Microspheres with Lower Thermal Conductivity

Product Feature

· Bulk density / true density: 55 to 65%

· Appearance: white flowing powder

· Dimensional accuracy and stability * Excellent

· Water-insoluble, acid resistance and alkali

· Stability: 600 °C when softened

· Oil absorption: 0.20 ~ 0.65g/cm3

· Wide temperature range: from -20 °C ~ 500 °C low temperature

· PH value: 8.0 ~ 9.5

· Dielectric constant: 2-3


High Strength Hollow Glass Microspheres with Lower Thermal Conductivity

Application

Building materials in the field using its thermal insulation effect, mainly for reflective insulation coating, putty, adhesives, etc.;

Composite materials primarily low density and ease of use of its processing characteristics, as to reduce the material, reducing its weight components to improve component quality;

Aerospace navigation using its light weight, high compressive strength characteristics of the production of lightweight components;

Oil and gas exploration in the field of drilling fluid used as a low-density and low-density cement slurry.


High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
High Strength Hollow Glass Microspheres with Lower Thermal Conductivity

Packaging & Shipping
High Strength Hollow Glass Microspheres with Lower Thermal Conductivity
Company Profile

High Strength Hollow Glass Microspheres with Lower Thermal ConductivityHigh Strength Hollow Glass Microspheres with Lower Thermal Conductivity

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